A process in which transparent flexible tape has tracks created on its surface. The pads on unpackaged integrated circuits are attached to corresponding pads on the tape which is then stored in a reel. Silver-loaded epoxy is screen printed on the substrate at the site where the device is to be located and onto the pads to which the device's leads are to be connected. The reel of TAB tape is fed through an automatic machine which pushes the device and the TAB leads into the epoxy. When the silver-loaded epoxy is cured using reflow soldering or vapor-phase soldering, it forms electrical connections between the TAB leads and the pads on the substrate.

A register output which is used to generate the next data input to a linear feedback shift register.

A process in which transparent flexible tape has tracks created on its surface. The pads on unpackaged integrated circuits are attached to corresponding pads on the tape which is then stored in a reel. Silver-loaded epoxy is screen printed on the substrate at the site where the device is to be located and onto the pads to which the device's leads are to be connected. The reel of TAB tape is fed through an automatic machine which pushes the device and the TAB leads into the epoxy. When the silver-loaded epoxy is cured using reflow soldering or vapor-phase soldering, it forms electrical connections between the TAB leads and the pads on the substrate.

Unit qualifier (symbol = T) representing one million million, or 10¹². For example, 3THz stands for
3 x 10¹² Hertz

An experimental technology in which logic gates are based on three distinct voltage levels. The three voltages are used to represent the tertiary digits 0, 1, and 2, and their logical equivalents FALSE, TRUE, and MAYBE.

A special pattern etched around a via or a plated through-hole to connect it into a power or ground plane. A thermal relief pad is necessary to prevent too much heat being absorbed into the power or ground plane when the board is being soldered.

Typically used to refer to the problems associated with optical interconnection systems whose alignment may be disturbed by changes in temperature.

A process used in the manufacture of hybrids and, to a lesser extent, multichip modules in which signal and dielectric (insulating) layers are screen-printed onto the substrate.

A process used in the manufacture of hybrids and multichip modules in which signal layers and dielectric (insulating) layers are created using opto-lithographic techniques.

A via that passes all the way through the substrate.

A commonly used abbreviation of "through-hole".

The time taken for a signal to propagate from one logic gate or opto-electronic component to another.

An electroless plating process in which exposed areas of copper on a circuit board are coated with a layer of tin-lead alloy. The alloy is used to prevent the copper from oxidizing and provides protection against contamination.

An abbreviation of tin-lead plating, which is an electroless plating process in which exposed areas of copper on a circuit board are coated with a layer of tin-lead alloy. The alloy is used to prevent the copper from oxidizing and provides protection against contamination.

Refers to the contents or outputs of a logic function switching to the inverse of their previous logic values.

A conducting connection between electronic components. May also be called a track or a signal. In the case of integrated circuits, such interconnections are often referred to collectively as metalization.

A conducting connection between electronic components. May also be called a trace or a signal. In the case of integrated circuits, such interconnections are often referred to collectively as metalization.

A device that converts input energy of one form into output energy of another.

A three-terminal semiconductor device that, in the digital world, can be considered to operate like a switch.

A function whose output can adopt three states: 0, 1, and Z (high-impedance) The function does not drive any value in the Z state and, in many respects, may be considered to be disconnected from the rest of the circuit.

A convenient way to represent the operation of a digital circuit as columns of input values and their corresponding output responses.

Logic gates implemented using particular configurations of bipolar junction transistors.

Logic gates implemented using particular configurations of bipolar junction transistors.

Glossary: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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